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Thermal Technologies

Choose air- or liquid-cooling components around your thermal and mechanical requirements.

Stepped aluminum heat sink with copper contact insert — illustrative concept
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Heat Sinks

Liquid Cooling

AI & Data Center Cooling

Manufacturing support for your cold plates, manifolds and cooling assemblies.

Processor cold plates and distribution manifold — illustrative concept
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AI Compute Cooling

Distribution & Assembly

AI Cooling Interfaces
  1. Cold PlateHeat-source interface
  2. ManifoldCoolant distribution
  3. CDU InterfaceConnection requirements
  4. Rack / LoopAssembly integration
Review component fit across your cooling system.

Industry Cooling Solutions

Find components for your power electronics, energy, laser and telecom application.

Machined power module cooling plate — illustrative concept
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Power Electronics

EV & Energy

Laser & Telecom

Industries

High-Tech & Electronics

Components for your electronic systems.

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Applications & Project Inquiries

Precision & Advanced Systems

Start with your functional and quality requirements.

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Applications & Project Inquiries

Industrial & Energy

Build around your operating environment.

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Applications & Project Inquiries

Materials

From prototype to production, review material performance, manufacturability and cost for your part.

Engineering Plastics

Match your polymer to function, process and environment.

→
ABS — illustrative material conceptABSReview enclosure and molding needs›Polycarbonate (PC) — illustrative material conceptPolycarbonate (PC)Discuss clarity and impact needs›Nylon (PA) — illustrative material conceptNylon (PA)Review moisture and wear conditions›POM / Acetal — illustrative material conceptPOM / AcetalReview fit and sliding features›PEEK — illustrative material conceptPEEKDiscuss operating conditions›PTFE — illustrative material conceptPTFEReview friction and chemical exposure›ULTEM / PEI — illustrative material conceptULTEM / PEIDiscuss thermal and electrical needs›

Elastomers & Specialty Materials

Confirm grade availability and application requirements.

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Elastomers
Silicone / LSR — illustrative material conceptSilicone / LSRDiscuss flexible component needs›TPU / TPE — illustrative material conceptTPU / TPEReview flexibility and processing›EPDM — illustrative material conceptEPDMReview weathering and chemical exposure.›NBR — illustrative material conceptNBRReview oil and fuel exposure.›FKM — illustrative material conceptFKMReview temperature and chemical exposure.›
Specialty Materials
G10 / FR4 — illustrative material conceptG10 / FR4Review insulation and laminate needs›Composites — illustrative material conceptCompositesReview stiffness, weight and laminate.›Customer-Specified MaterialsConfirm your grade and requirements.›Other Specialty MaterialsDiscuss your application and grade.›
Resources

Design & Engineering

Practical guidance for your part geometry and material decisions.

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Cost & Planning

Prepare your process, budget and sourcing questions.

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Learn & Proof

Build your knowledge before production.

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About Us

About LK MFG

Learn who we are and how we operate.

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Get in Touch

Find our U.S. support team or start a conversation.

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sales@lkmfg.com (945) 409-1013

1750 Briercroft Ct, Suite 204
Carrollton, TX 75006, USA

YOUR DATUMS. YOUR CLEANLINESS. YOUR RELEASED DRAWING.

Semiconductor Equipment Parts for Your Mounting & Inspection Requirements

Review your custom semiconductor equipment components around the installed interface, surface condition and required records. Define the manufactured part and sample acceptance before selecting the route.

Precision aluminum equipment support frame with distinct mounting planes and a separate circular support fixture; illustrative engineering concept, not a customer part or company test record

4 Decisions Before Your Manufacturing Review

When you compare a semiconductor equipment parts manufacturer, ask how your released drawing, surface requirements and inspection scope will be reviewed.

01 · Supplied part

Identify the housing, support, fixture or mounting component.

02 · Mating datums

Define locating faces, holes and the installed coordinate scheme.

03 · Surface state

State finish, cleaning, handling and packaging requirements.

04 · Approval evidence

Name the records and acceptance owner for your sample.

Compare 3 Component Scopes for Your Equipment

Equipment housings

Review connector openings, cover fit, sealing interfaces and access to internal features.

Your input: assembly envelope, ports and controlled mounting drawing.

Mounting and support parts

Match contact faces and locating bores to the actual equipment interface.

Your input: datum scheme, functional fits and installed loads.

Fixtures and handling interfaces

Define the locating sequence and accessible inspection points before manufacture.

Your input: mating-part information, handling state and acceptance criteria.

Manufacturing scope follows your drawing and project review. Equipment certification, cleanroom qualification and wafer-process validation are separate requirements.

Review Your Datums Before Your Toolpath

Machined circular support plate with locating shoulders, mounting slots and accessible functional faces; illustrative engineering concept, not a customer part or company test record

For your semiconductor equipment CNC machining review, identify the relationship between contact planes, locating bores and fastener access. Show the functional tolerances on the drawing rather than applying the same tight limit to every feature.

  • Released CAD and a toleranced 2D drawing
  • Functional datum structure and mating-part limits
  • Accessible tools, deburring and inspection points
  • Finish masks, cleaning and protected delivery surfaces
Review CNC manufacturing routes →

Review Thermal Movement at Your Equipment Interfaces

For semiconductor equipment aluminum components, the locating span and installed temperature matter alongside material identity. The comparison below models free thermal expansion; it is not a measured equipment result.

Calculated movement of a 100 mm span

Uniform heating from 20°C to 100°C · zero baseline, 0–200 µm

6061 reference
188.6 µm
316L / 1.4404
128.0 µm

ΔL = α × L × ΔT. Inputs: L = 100 mm; ΔT = 80 K; α = 23.58 × 10⁻⁶/K for 6061 and 16.0 × 10⁻⁶/K for 316L. Values rounded to 0.1 µm.

What Your Equipment Review Still Needs

Locating interfaces

Review the actual span, temperature distribution and mating material.

Constraints and surfaces

Include mounting restraint, final coating, protected contacts and accessible inspection features.

This simplified calculation assumes uniform temperature and unconstrained expansion. It does not predict assembly alignment, stress, cleanliness or vacuum performance.

Selected alloy identity references · weight percent; not process-compatibility approval
MaterialEuropean reference nameSelected compositionYour purchasing decision
6061EN AW-6061 · AlMg1SiCuSi 0.40–0.80; Mg 0.80–1.20; Cu 0.15–0.40; Cr 0.04–0.35; Al remainderConfirm temper, product form, certificate and post-joining condition.
316L / 1.4404X2CrNiMo17-12-2C ≤0.03; Cr 16.50–18.50; Ni 10.00–13.00; Mo 2.00–2.50; Fe balanceSpecify the actual environment, material standard and inspection record.

Hydro gives a mean 6061 expansion coefficient of 13.1 × 10⁻⁶/°F over 68–212°F; conversion to per kelvin multiplies by 1.8, giving 23.58 × 10⁻⁶/K over 20–100°C. The 316L supplier value is 16.0 × 10⁻⁶/K over the same range. Both are reference inputs, not a material substitution authorization. Selected composition elements only; purchasing specification, product form and final condition govern.

Hydro 6061 · coefficient and composition ↗ thyssenkrupp 316L · coefficient and composition ↗

Separate 3 Interface Questions

A

Where does your part locate?

Define the primary contact plane and the permitted positional relationship.

B

Which features control assembly?

Identify the mating bore, pins, fasteners and required clearances.

C

What will your team approve?

Agree measurement access, sampling and the required record format.

Interface sequence is an explanatory concept, not a tolerance calculation or measured capability result.

Approve the Delivered Part and the Required Records

Your dimensional evidence

Connect each critical feature to the drawing revision, measurement method and agreed acceptance limit.

Your material and finish evidence

Specify the material record, final finish, masked interfaces and any additional surface or cleanliness checks.

Your handling and delivery state

Agree protection for contact faces, packaging, part identification and the person approving the sample.

CMM probe approaching a supported aluminum equipment block datum for dimensional review; illustrative engineering concept, not a customer part or company test record

A dimensional report does not establish vacuum performance, particle cleanliness or process compatibility. Specify those validation boundaries separately.

5 Checkpoints from Drawing to Repeat Supply

For semiconductor equipment CNC machining, confirm tool access, functional datums and the final material condition before the route is agreed.

01 · Drawing review

Confirm the latest part and assembly revision.

02 · Route review

Agree material, machining and finish requirements.

03 · Sample build

Produce the controlled sample configuration.

04 · Agreed checks

Review the required evidence and open issues.

05 · Repeat release

Carry approved requirements into the next build.

6 Inputs for Your Component Review

  1. CAD and released 2D drawing
  2. Installed interface and datum scheme
  3. Material specification and final condition
  4. Finish, cleaning and packaging requirements
  5. Trial quantity and repeat demand
  6. Required records and approval owner

Answers Before You Specify

What drawings are needed for semiconductor equipment parts?

Provide CAD, a released 2D drawing with functional datums and tolerances, material and finish specifications, cleaning and packaging requirements, quantities and the required inspection records.

Can I request a material certificate and dimensional report?

Identify the purchasing material specification, traceability needs, critical dimensions and report format before quotation. The reviewed manufacturing scope confirms which records are included.

How do I specify cleanliness and protected surfaces?

Name the required surface state, residues or contamination limits, cleaning method where specified, packaging and acceptance method. Do not assume a general machining quote includes cleanroom or process qualification.

What affects my component quotation?

Geometry, stock and material condition, functional tolerances, accessible machining, finish, cleaning, inspection scope and quantity affect the reviewed quote. Send the installed-interface information with your drawing.