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Precision manufacturing. Stronger together.Manufacturing Services & Support

From prototype to production, coordinated manufacturing solutions for your custom parts.

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Solutions

Thermal Technologies

Choose air- or liquid-cooling components around your thermal and mechanical requirements.

Stepped aluminum heat sink with copper contact insert — illustrative concept
Explore Thermal Technologies

Heat Sinks

Liquid Cooling

AI & Data Center Cooling

Manufacturing support for your cold plates, manifolds and cooling assemblies.

Processor cold plates and distribution manifold — illustrative concept
Explore AI Cooling

AI Compute Cooling

Distribution & Assembly

AI Cooling Interfaces
  1. Cold PlateHeat-source interface
  2. ManifoldCoolant distribution
  3. CDU InterfaceConnection requirements
  4. Rack / LoopAssembly integration
Review component fit across your cooling system.

Industry Cooling Solutions

Find components for your power electronics, energy, laser and telecom application.

Machined power module cooling plate — illustrative concept
Explore Industry Cooling

Power Electronics

EV & Energy

Laser & Telecom

Industries

High-Tech & Electronics

Components for your electronic systems.

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Applications & Project Inquiries

Precision & Advanced Systems

Start with your functional and quality requirements.

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Applications & Project Inquiries

Industrial & Energy

Build around your operating environment.

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Applications & Project Inquiries

Materials

From prototype to production, review material performance, manufacturability and cost for your part.

Engineering Plastics

Match your polymer to function, process and environment.

→
ABS — illustrative material conceptABSReview enclosure and molding needs›Polycarbonate (PC) — illustrative material conceptPolycarbonate (PC)Discuss clarity and impact needs›Nylon (PA) — illustrative material conceptNylon (PA)Review moisture and wear conditions›POM / Acetal — illustrative material conceptPOM / AcetalReview fit and sliding features›PEEK — illustrative material conceptPEEKDiscuss operating conditions›PTFE — illustrative material conceptPTFEReview friction and chemical exposure›ULTEM / PEI — illustrative material conceptULTEM / PEIDiscuss thermal and electrical needs›

Elastomers & Specialty Materials

Confirm grade availability and application requirements.

→
Elastomers
Silicone / LSR — illustrative material conceptSilicone / LSRDiscuss flexible component needs›TPU / TPE — illustrative material conceptTPU / TPEReview flexibility and processing›EPDM — illustrative material conceptEPDMReview weathering and chemical exposure.›NBR — illustrative material conceptNBRReview oil and fuel exposure.›FKM — illustrative material conceptFKMReview temperature and chemical exposure.›
Specialty Materials
G10 / FR4 — illustrative material conceptG10 / FR4Review insulation and laminate needs›Composites — illustrative material conceptCompositesReview stiffness, weight and laminate.›Customer-Specified MaterialsConfirm your grade and requirements.›Other Specialty MaterialsDiscuss your application and grade.›
Resources

Design & Engineering

Practical guidance for your part geometry and material decisions.

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Cost & Planning

Prepare your process, budget and sourcing questions.

Explore Planning Topics

Learn & Proof

Build your knowledge before production.

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About Us

About LK MFG

Learn who we are and how we operate.

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Get in Touch

Find our U.S. support team or start a conversation.

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sales@lkmfg.com (945) 409-1013

1750 Briercroft Ct, Suite 204
Carrollton, TX 75006, USA

YOUR INTERFACES · YOUR CONDITIONS · YOUR ACCEPTANCE

Bonded Fin Heat Sinks
for Your Fin Layout, Joint & Assembly

Build your review around the connection between each fin and the base. Compare material combinations, fin spacing, bondline control and the evidence you need before approving a bonded fin heat sink.

Illustrative bonded fin heat sinks assembly concept, not a customer part

Illustrative component concept

Drawing

Critical geometry & interfaces

Materials

Grades, condition & compatibility

Joining

Defined route & final state

Evidence

Agreed methods & records

Start with Your Fin-to-Base Assembly Requirements

Review fin geometry, the actual joining route and your installed conditions together. Define the final fit and evidence before approving the assembly.

  • Specify fins, slots and base features
  • Define the fin-to-base joining route
  • Review airflow, temperature cycles and vibration
  • Agree final flatness and joint evidence
  • Confirm the sample and acceptance evidence
Illustrative fin geometry concept, not documentary company or customer photography

Fin geometry

Specify fin thickness, clear spacing, height and the base-slot layout.

Illustrative joint definition concept, not documentary company or customer photography

Joint definition

Identify the adhesive or metallurgical joining route; do not leave the joint as an unstated assumption.

Illustrative service conditions concept, not documentary company or customer photography

Service conditions

Share temperature range, thermal cycles, vibration and the installed airflow.

Illustrative finished fit concept, not documentary company or customer photography

Finished fit

Define mounting datums and heat sink base flatness after joining and any final machining.

Illustrative engineering concepts

Compare 4 Route Decisions for Your Geometry

Compare the joint route and acceptance needs together. Your drawing and service conditions determine suitability; the images illustrate structures, not confirmed company capability.

Illustrative engineering concepts

Choose Your Fin-to-Base Joint Deliberately

FIN LAYOUT & BASE FEATURES↓MATERIAL & FIN JOINT↓SAMPLE & AGREED CHECKS↓APPROVED FINISHED PART

Separate fins seated in a base let you review fin geometry and base features independently. Your bonded fin heat sink manufacturing service must define the actual joining route: an adhesive joint and a brazed joint need different materials, processing and acceptance evidence.

  • Identify the complete material and joining system.
  • Review your critical interfaces in their final production state.
  • Agree sample evidence before repeat-order release.
Compare thermal technology routes →

Compare Material References, Then Confirm Your Final Condition

Bulk stock properties help you review conduction and mass. These are sourced material references, not LK MFG part tests, approved material substitutions or post-joining performance guarantees.

Typical thermal conductivity

6061-T6 · 25°C167 W/(m·K)
6063-T5 · typical209 W/(m·K)
Cu-ETP annealed · 20°C394 W/(m·K)

Hydro 6061-T6 at 25°C; Gabrian 6063-T5 typical. KME Cu-ETP annealed at 20°C.

Density reference

6061 / 60632.7 g/cm³
Cu-ETP8.92 g/cm³

Calculate finished mass from the actual geometry. A material conductivity difference does not establish a device-temperature reduction.

Selected composition limits · weight %
GradeEuropean referenceSiFeCuMnMgZnAl
6061EN AW-6061 · AlMg1SiCu0.40–0.80≤0.700.15–0.40≤0.150.80–1.20≤0.25Balance
6063EN AW-6063 · AlMg0.7Si0.20–0.60≤0.35≤0.10≤0.100.45–0.90≤0.10Balance
C11000Cu-ETP · CW004A——≥99.90————

Selected elements only. Dash means not specified in this summary, not zero. 6061: Cr 0.04–0.35%, Ti ≤0.15%; 6063: Cr/Ti ≤0.10% each. C11000: O ≤0.040%; do not relabel Cu-ETP as oxygen-free copper. Aluminum other elements ≤0.05% each / ≤0.15% total. The purchasing standard and certificate govern. Confirm product form, temper, joining compatibility and required final condition.

Sources: Hydro 6061 → · Gabrian 6063 → · KME Cu-ETP →

3 Views for Your Thermal Review

Use calculations to frame your questions. Request measured curves or CFD only with an agreed geometry, boundary conditions and validation scope. Every example here is illustrative.

1 · Bond-layer calculation

20 μm example0.002 K/W
50 μm example0.005 K/W
100 μm example0.01 K/W

Hypothetical example only: R = t/(kA), with k = 1 W/(m·K), A = 0.01 m² and t as labelled. These chosen inputs are not an adhesive data sheet, a validated bondline or a finished heat sink test.

2 · Temperature allowance

50 K40 K30 K25°C ref.35°C ref.45°C ref.

Chosen example: 75°C limit minus a reference of 25, 35 or 45°C gives 50, 40 or 30 K. Define whether your reference is ambient, inlet fluid or another measurement point.

3 · Follow your heat path

HEAT SOURCE + TIM↓BASE → JOINT → FINS↓INSTALLED AIRFLOW

A conceptual path, not a CFD result. Agree heat-source area, power, contact stack, sensor locations, airflow and orientation.

Review Your Surface and Handling Requirements

Review thermal contact faces, mounting features and fin handling separately. Confirm finish compatibility with the specified joint and service environment.

Illustrative contact faces on a bonded fin heat sink concept, not documentary company or customer photography

Define the final contact pad, coating exclusions and inspection state.

A finish is not a universal cooling improvement. Confirm its purpose, compatibility and inspection state. Review surface finishing options →

Illustrative engineering concepts

Define Your Functional Features

Put the fin layout, joining interfaces, final contact area and assembly datums on your drawing.

Illustrative separate fins seated in base grooves with an illustrative thin joint layer concept, not documentary company or customer photography

Illustrative fin-to-base joint concept

Contact footprint

Heat-source map, TIM and clamping stack

Fin-to-base joint

Slot engagement, joint route and surface preparation

Mounting datums

Hole pattern, datum scheme and tool access

Fin geometry

Thickness, spacing, height and airflow orientation

Final condition

Flatness, masking, protected interfaces and inspection state

Resolve 6 Design Risks Before Your Order

Review your fin joint, installed airflow, final fit and acceptance evidence before production.

Bond integrity

Agree a fin bond integrity verification method, sampling and acceptance criteria. A visual check alone does not establish bond strength.

Your input

Controlled drawing and the relevant service conditions.

Your acceptance

Agreed method, inspection state, limits and required records.

Illustrative bond integrity review for a bonded fin heat sink concept, not documentary company or customer photography

Illustrative engineering concept

5 Checkpoints from Drawing to Repeat Supply

Drawing review

Confirm revision, interfaces and operating inputs.

Route review

Agree materials, joining and final machining.

Sample build

Review the finished component and assembly fit.

Agreed checks

Assess specified dimensions, joints and test records.

Production release

Release the accepted revision, packaging and repeat-order scope.

Approve the Joint and the Finished Assembly

Illustrative bonded fin heat sinks dimensional inspection concept, not a customer part

Illustrative component concept

Your prototype bonded fin heat sink should establish drawing revision, material identity, joint process and the agreed inspection plan. Bond strength, thermal cycling and thermal resistance are separate requirements with their own conditions; agree which records belong in your sample package.

  • Material identity and drawing revision
  • Final contact face, mounting and interface dimensions
  • Specified joining and test evidence
  • Port or fin protection and shipment release
Review quality requirements →

Review Your Application, Not Just the Outside Shape

Project suitability, manufacturing scope and required records are confirmed from your drawing. These are application review topics, not customer case studies or system certifications.

Illustrative bonded fin heat sink in a power electronics assembly concept, not documentary company or customer photography

Power electronics

Match module footprint, insulation, clamp load and the heat-source map.

Inverters and drives

Review switching heat loads, service temperatures and mounting interfaces.

Energy equipment

Agree operating conditions and the component acceptance scope.

Laser power supplies

Review temperature stability requirements, airflow and service access.

Compute components

Review the exact device footprint, airflow path, mounting interfaces and enclosure clearance.

Test equipment

Identify instrument clearances, heat loads and service access.

Thermal test fixtures

Define contact layout, airflow conditions and the agreed validation scope.

Industrial controls

Match the enclosure interfaces, airflow openings and maintenance plan.

Illustrative assembly and application review topics; no customer case study, system certification or universal fit claim. Explore application requirements →

6 Inputs for Your Bonded Fin Heat Sinks Quote

  1. CAD, fin layout + controlled drawing
  2. Heat load, airflow + temperature range
  3. Fin and base grades + material condition
  4. Joint route + bond acceptance requirements
  5. Mounting, final flatness + finish
  6. Prototype quantity + repeat demand

Ask your quote to separate component manufacturing, joining, finishing, inspection and any independently agreed validation. The drawing review confirms availability, quantities and delivery scope.

Answers Before You Specify

How is fin bond integrity verified on a bonded heat sink?

Agree the method before the sample: joint preparation and process records, visual criteria and any specified mechanical or section checks. Define sample quantities and limits. Do not treat a clean-looking joint as proof of bond strength.

Can bonded heat sink fins use a different metal from the base?

It is a design option to review, not an automatic substitution. Check the joining method, thermal expansion, service temperature, environment and corrosion protection with your assembly.

What thermal cycling requirements should my quote include?

State temperature limits, dwell and transition conditions, cycle count, restraint, inspection intervals and acceptance criteria. Agree whether joint, dimensional and thermal checks are needed before and after cycling.

How does a bonded fin design differ from a brazed heat sink?

Here, adhesive bonding means a polymer-based joint; brazing uses a lower-melting filler metal to form a metallurgical joint. The joint temperature capability and qualification depend on the actual materials and process, so specify the route explicitly.

What information is needed for a bonded fin heat sink quote?

Send the fin and base drawing, joining requirements, material grades, operating conditions, critical fits and quantities. Ask for prototype and repeat-supply scope to be identified separately.

Does a low-resistance bond guarantee a lower device temperature?

No. Joint resistance is one part of the path. Contact interfaces, base spreading, fin geometry and installed airflow also affect the result. Compare the complete assembly under the same test conditions.