Injection Molding
Tooling and molding for your repeat plastic parts.
YOUR INTERFACES · YOUR CONDITIONS · YOUR ACCEPTANCE
IGBT Cooling
for Your Module Footprint, Contact Stack & Cooling Route
Review your IGBT cooling component against the exact module part number, loss map, mounting instructions and installed conditions. Define the contact face, mounting holes, thermal interface and air or coolant connections before manufacturing release.
Illustrative component concept
Drawing
Critical geometry & interfaces
Materials
Grades, condition & compatibility
Interfaces
Defined route & final state
Evidence
Agreed methods & records
Start with Your Exact Module and Mounting Requirements
Define the module footprint, dissipated losses, contact stack, installed conditions and sample evidence.
- Identify exact module and current mounting instructions
- Share dissipated losses and actual operating conditions
- Review contact, mounting and coolant or airflow
- Agree component and platform acceptance separately
- Confirm the sample and acceptance evidence
Exact module and contact stack
Your IGBT module cooling interface starts with the selected part number, released mounting instructions, contact footprint, TIM and any required electrical isolation. Identify the temperature limits and who approves the module assembly.
Dissipated losses and conditions
Share the module loss map and relevant operating or transient conditions. State available airflow or coolant inlet temperature and flow. Keep IGBT cooling thermal resistance tied to named temperature nodes and the actual test configuration.
Mounting and connections
Define IGBT cold plate mounting holes, datums, module keep-outs, fasteners and service access from the selected module documentation. For liquid cooling, add port standards, fitting positions, seals and the supplied assembly boundary.
Quote and sample evidence
When choosing an IGBT cold plate manufacturer, compare the supplied scope and required evidence against your drawing. Your custom IGBT cold plate quote should include material, final condition, quantities and agreed dimensional, leak and separate performance checks.
Illustrative engineering concepts
Compare 4 Component Scopes for Your IGBT Module
Choose a route against the actual module and installed conditions. These concepts do not establish package compatibility, an operating power range or complete converter qualification.
Air-Cooled Heat Sinks
Review available airflow, fin direction, base contact and enclosure clearance.
Review this cooling scope →
Liquid Cold Plates
Define heat-source map, coolant, ports, contact lands and sample checks.
Review this cooling scope →
Machined Contact Interfaces
Review copper or aluminum geometry, mounting datums and final surface state.
Review this cooling scope →
Defined Component Assemblies
List mounting hardware, selected fittings, brackets and delivered records.
Review this cooling scope →Illustrative engineering concepts
Choose Your IGBT Component Route from the Released Module Data
MODULE + LOSSES + INTERFACES↓COMPONENTS & CONNECTIONS↓SAMPLE & AGREED CHECKS↓APPROVED FINISHED PART
IGBT cooling plate machining should follow the controlled module footprint, mating datums and final inspection state. For IGBT liquid cooling, define the coolant, flow, inlet temperature, channels, ports and allowed pressure loss. An IGBT heat sink prototype needs the available airflow, fin direction, enclosure and actual dissipated losses; neither a module current rating nor a photograph establishes the cooling requirement.
- Define the supplied parts, material and connection boundary.
- Review your critical interfaces in their final production state.
- Agree sample evidence before repeat-order release.
Mounting references: Infineon Easy module instructions → · Fuji IGBT module application manual →. Use the current documentation for your exact module; these references do not establish LK MFG capability, compatibility or a universal mounting limit.
Compare Your Cold-Plate Material References
Compare bulk conduction and mass alongside your module contact stack, coolant, coatings and manufacturing route. These references are not finished IGBT cooling tests or material substitution approvals.
Typical thermal conductivity
Hydro 6061-T6 at 25°C. KME Cu-ETP annealed at 20°C.
Density reference
Calculate finished mass from the actual geometry. A material conductivity difference does not establish a device-temperature reduction.
| Grade | European reference | Si | Fe | Cu | Mn | Mg | Zn | Al |
|---|---|---|---|---|---|---|---|---|
| 6061 | EN AW-6061 · AlMg1SiCu | 0.40–0.80 | ≤0.70 | 0.15–0.40 | ≤0.15 | 0.80–1.20 | ≤0.25 | Balance |
| C11000 | Cu-ETP · CW004A | — | — | ≥99.90 | — | — | — | — |
Selected elements only. Dash means not specified in this summary, not zero. 6061: Cr 0.04–0.35%, Ti ≤0.15%; C11000: O ≤0.040%; do not relabel Cu-ETP as oxygen-free copper. Aluminum other elements ≤0.05% each / ≤0.15% total. The purchasing standard and certificate govern. Confirm product form, temper, joining compatibility and required final condition.
Sources: Hydro 6061 → · KME Cu-ETP →
3 Views Before You Approve Your IGBT Cooling Sample
Set a named temperature budget, follow the selected mounting documentation and define validation. The numeric graphic is chosen arithmetic, not a measured thermal curve, junction limit or part rating.
1 · Chosen case-to-reference budget
Chosen example: a 20 K case-to-reference allowance divided by 200, 400 or 800 W dissipated losses gives 0.10, 0.05 or 0.025 K/W. These are not LK MFG ratings or recommended module limits. Define the actual reference node, contact path and transient conditions; junction-to-case behavior remains a separate module-specific input.
2 · Control the mounting interface
EXACT MODULE + CURRENT INSTRUCTIONS↓CONTACT FACE + TIM + CLAMPING↓SEPARATE ISOLATION REQUIREMENTS
Surface and installation requirements depend on the selected package. Use its released instructions and controlled drawing; do not transfer numeric flatness, TIM or tightening values from a different module.
3 · Agree the performance conditions
LOSS MAP + SENSORS + MOUNTING↓AIRFLOW OR COOLANT + INLET + FLOW↓HYDRAULIC / THERMAL APPROVAL OWNER
State the actual configuration, operating conditions and acceptance before validation. Dimensions, leak integrity, electrical isolation and thermal performance are separate evidence scopes.
Review Your Surface and Cleanliness Requirements
Separate your thermal contact faces, sealing interfaces and wetted passages. Confirm the specified final condition with the mating assembly.
Define the module contact area and final surface inspection state from the released drawing.
Specify the finished thread, fitting engagement and agreed sealing surfaces.
Protect fins, finished contact faces and ports; agree cleaning and shipment condition.
A finish is not a universal cooling improvement. Confirm its purpose, compatibility and inspection state. Review surface finishing options →
Illustrative engineering concepts
Define Your Functional Features
Put the dimensions that control sealing, assembly fit and heat transfer on your drawing.
Illustrative IGBT cold plate section concept
Contact footprint
Module loss map, selected TIM and approved clamping stack
Ports and seals
Thread designation, seal land and fitting engagement
Mounting datums
Hole pattern, datum scheme and tool access
Cover and passages
Joining access, wall thickness and cleaning scope
Final condition
Flatness, masking, protected interfaces and inspection state
Resolve 6 Design Risks Before Your Order
Resolve contact flatness, TIM and isolation responsibility, connection checks, material, operating conditions and approval evidence.
Contact face and flatness
Specify IGBT cooling plate flatness, roughness and inspection area from the exact module mounting instructions and released drawing. Include the installed clamping arrangement and final manufacturing state. Do not copy one package's numeric limits onto another.
Your input
Controlled drawing and the relevant service conditions.
Your acceptance
Agreed method, inspection state, limits and required records.
Illustrative engineering concept
TIM and electrical isolation
Review IGBT cooling electrical isolation separately from thermal contact. Use the selected module and interface material documentation for dielectric requirements, installation and qualification; a thermally conductive paste or coating must not be assumed to provide the required insulation.
Your input
Controlled drawing and the relevant service conditions.
Your acceptance
Agreed method, inspection state, limits and required records.
Exploded interface concept; TIM properties and electrical isolation are not established by the illustration.
Connections and leak scope
Agree IGBT cooling plate leak testing for the actual supplied plate, joining route, fittings, seals and plugs. State the medium, temperature, limit, duration and records. Pressure checks and thermal or hydraulic validation require their own defined scopes.
Your input
Controlled drawing and the relevant service conditions.
Your acceptance
Agreed method, inspection state, limits and required records.
Illustrative engineering concept
Material and coolant
Review IGBT cooling component material selection against contact geometry, mass, manufacturing route and all wetted materials, coatings, seals and coolant conditions. Bulk conductivity is one reference, not finished cooling performance or compatibility approval.
Your input
Controlled drawing and the relevant service conditions.
Your acceptance
Agreed method, inspection state, limits and required records.
Illustrative engineering concept
Airflow and hydraulic boundary
For an air-cooled part, state installed airflow and fin direction. For a cold plate, evaluate IGBT cooling plate pressure drop at the specified fluid, temperature, flow and measurement boundary. Keep pump duty, flow sharing and module thermal validation with their assigned owners.
Your input
Controlled drawing and the relevant service conditions.
Your acceptance
Agreed method, inspection state, limits and required records.
Illustrative engineering concept
Sample and performance approval
Define IGBT cooling sample approval for the controlled revision, material, finished contact face, mounting fit and specified records. Approve hydraulic and thermal performance using the agreed module losses, TIM, mounting, sensors and operating conditions.
Your input
Controlled drawing and the relevant service conditions.
Your acceptance
Agreed method, inspection state, limits and required records.
Illustrative engineering concept
5 Checkpoints from Drawing to Repeat Supply
Drawing review
Confirm revision, interfaces and operating inputs.
Route review
Agree materials, joining and final machining.
Sample build
Review the finished component and assembly fit.
Agreed checks
Assess specified dimensions, joints and test records.
Production release
Release the accepted revision, packaging and repeat-order scope.
Approve Your Contact Geometry and Keep Performance Evidence Separate
Illustrative component concept
Your custom IGBT cold plate quote should connect the exact module footprint and mounting documentation to the material, final contact surface, ports and supplied records. Agree sample dimensions, fit, cleanliness and specified leak checks. A dimensional report or leak record does not establish junction temperature, electrical isolation or complete converter performance.
- Material identity and drawing revision
- Module contact face, mounting datums and ports
- Specified joining and test evidence
- Contact-face and port protection, packaging and release
Match Your Cooling Part to the Released Power Module
These are component review contexts, not customer cases, automotive qualification, certified converters or endorsed package compatibility.
Industrial drives
Review the selected module loss map and installed cooling route.
Power converters
Control contact footprint, mounting and nearby keep-outs.
Renewable power equipment
Define operating conditions and the approval owner.
Charging power stages
Review coolant connections or available airflow.
Traction component prototypes
Match the released module interfaces and supplied part scope.
Power supply modules
State exact footprints and the dissipated losses.
Validation fixtures
Control TIM, mounting, sensor positions and operating inputs.
Replacement cooling parts
Match the exact module and installed revisions.
6 Inputs for Your IGBT Cooling Quote
- Exact module part number + current mounting instructions
- Loss map, duty cycle + temperature-node limits
- Contact footprint, TIM + isolation responsibility
- Mounting datums, holes, fasteners + keep-outs
- Installed airflow or coolant, flow + pressure allowance
- Material, quantities + sample checks and validation owner
Ask your quote to separate component manufacturing, joining, finishing, inspection and any independently agreed validation. The drawing review confirms availability, quantities and delivery scope.
Answers Before You Specify
What module data is needed for a custom IGBT cold plate quote?
Provide the exact module part number, datasheet and current mounting instructions, loss map and operating conditions, footprint and datums, TIM and isolation requirements, coolant or airflow, quantities and required records. Mark the supplied manufacturing boundary.
Can IGBT module flatness requirements be copied between packages?
No. Use the selected module's current mounting documentation and released drawing. The inspection area, surface conditions, clamp arrangement and final part state must match that package and assembly; a generic catalog value is not a universal requirement.
Does thermal interface material provide IGBT electrical insulation?
Do not assume it. Confirm whether the selected package and specified interface system provide the required dielectric function, and follow their installation and qualification requirements. Thermal contact, electrical isolation and any required electrical verification are separate approval decisions.
Which tests should be specified for an IGBT cooling plate sample?
Agree material identity, contact face and mounting dimensions, fit, cleanliness and any specified leak or pressure checks. Define thermal and hydraulic validation separately with module losses, TIM, mounting, inlet or ambient conditions, flow and measurement locations.
Should your component use air or liquid cooling?
Compare the actual dissipated losses, temperature budget, mounting envelope and installed air or coolant conditions. Review component availability and manufacturing route against your drawing; there is no universal power threshold that selects a route for every module.
Does a leak check prove your module will meet its temperature limit?
No. A leak check covers the defined fluid-integrity boundary. Module temperature also depends on losses, thermal contact, mounting and operating conditions. Name the validation owner and agree the thermal test and acceptance before release.
