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Thermal Technologies

Choose air- or liquid-cooling components around your thermal and mechanical requirements.

Stepped aluminum heat sink with copper contact insert — illustrative concept
Explore Thermal Technologies

Heat Sinks

Liquid Cooling

AI & Data Center Cooling

Manufacturing support for your cold plates, manifolds and cooling assemblies.

Processor cold plates and distribution manifold — illustrative concept
Explore AI Cooling

AI Compute Cooling

Distribution & Assembly

AI Cooling Interfaces
  1. Cold PlateHeat-source interface
  2. ManifoldCoolant distribution
  3. CDU InterfaceConnection requirements
  4. Rack / LoopAssembly integration
Review component fit across your cooling system.

Industry Cooling Solutions

Find components for your power electronics, energy, laser and telecom application.

Machined power module cooling plate — illustrative concept
Explore Industry Cooling

Power Electronics

EV & Energy

Laser & Telecom

Industries

High-Tech & Electronics

Components for your electronic systems.

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Applications & Project Inquiries

Precision & Advanced Systems

Start with your functional and quality requirements.

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Applications & Project Inquiries

Industrial & Energy

Build around your operating environment.

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Applications & Project Inquiries

Materials

From prototype to production, review material performance, manufacturability and cost for your part.

Engineering Plastics

Match your polymer to function, process and environment.

→
ABS — illustrative material conceptABSReview enclosure and molding needs›Polycarbonate (PC) — illustrative material conceptPolycarbonate (PC)Discuss clarity and impact needs›Nylon (PA) — illustrative material conceptNylon (PA)Review moisture and wear conditions›POM / Acetal — illustrative material conceptPOM / AcetalReview fit and sliding features›PEEK — illustrative material conceptPEEKDiscuss operating conditions›PTFE — illustrative material conceptPTFEReview friction and chemical exposure›ULTEM / PEI — illustrative material conceptULTEM / PEIDiscuss thermal and electrical needs›

Elastomers & Specialty Materials

Confirm grade availability and application requirements.

→
Elastomers
Silicone / LSR — illustrative material conceptSilicone / LSRDiscuss flexible component needs›TPU / TPE — illustrative material conceptTPU / TPEReview flexibility and processing›EPDM — illustrative material conceptEPDMReview weathering and chemical exposure.›NBR — illustrative material conceptNBRReview oil and fuel exposure.›FKM — illustrative material conceptFKMReview temperature and chemical exposure.›
Specialty Materials
G10 / FR4 — illustrative material conceptG10 / FR4Review insulation and laminate needs›Composites — illustrative material conceptCompositesReview stiffness, weight and laminate.›Customer-Specified MaterialsConfirm your grade and requirements.›Other Specialty MaterialsDiscuss your application and grade.›
Resources

Design & Engineering

Practical guidance for your part geometry and material decisions.

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Cost & Planning

Prepare your process, budget and sourcing questions.

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Learn & Proof

Build your knowledge before production.

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About Us

About LK MFG

Learn who we are and how we operate.

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Get in Touch

Find our U.S. support team or start a conversation.

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sales@lkmfg.com (945) 409-1013

1750 Briercroft Ct, Suite 204
Carrollton, TX 75006, USA

YOUR INTERFACES · YOUR CONDITIONS · YOUR ACCEPTANCE

Power Module Cooling
for Your Package, Contact Footprint & Approval Conditions

Match your power module cooling part to the exact package and mounting instructions. Review the contact surface, heat-source footprint, TIM or direct-fluid boundary, mounting features and acceptance evidence before choosing the manufacturing route.

Illustrative power module cooling assembly concept, not a customer part

Illustrative component concept

Drawing

Critical geometry & interfaces

Materials

Grades, condition & compatibility

Interfaces

Defined route & final state

Evidence

Agreed methods & records

Start with Your Package and Contact Boundary

Define the selected package, heat path, mounting and sample evidence before selecting a route.

  • Identify the package and current mounting instructions
  • Map dissipated losses and temperature nodes
  • Review contact, mounting and coolant or airflow
  • Agree component and platform acceptance separately
  • Confirm the sample and acceptance evidence
Illustrative exact package and heat path concept, not documentary company or customer photography

Exact package and heat path

Identify the module part number, current datasheet and mounting instructions. Your power module cooling interface must state whether heat passes through a baseplate and TIM or an explicitly specified direct-fluid package interface. Do not infer that boundary from appearance.

Illustrative losses and contact footprint concept, not documentary company or customer photography

Losses and contact footprint

Provide dissipated losses, source locations, duty cycle and named temperature limits. Keep power module cooling thermal resistance tied to the stated temperature nodes, interface stack and operating conditions. Separate steady-state and transient approval cases.

Illustrative mounting and service access concept, not documentary company or customer photography

Mounting and service access

Define power module cold plate mounting holes, datums, keep-outs, support points and fastener access on the controlled drawing. State the available air path or coolant connections and which fittings, seals and brackets are included in the supplied part.

Illustrative quote and prototype scope concept, not documentary company or customer photography

Quote and prototype scope

When comparing a power module cold plate manufacturer or power module heat sink manufacturer, review the supplied scope and required evidence. Your custom power module cold plate quote or custom power module heat sink quote should include material, quantities, final surfaces and sample checks. Mark the power module cooling prototype revision and approval owner.

Illustrative engineering concepts

Compare 4 Manufacturing Scopes for Your Module

Choose a route against the actual module and installed conditions. These concepts do not establish package compatibility, an operating power range or complete converter qualification.

Illustrative engineering concepts

Choose Your Cooling Part from the Actual Module Package

HEAT MAP & INTERFACES↓COMPONENTS & CONNECTIONS↓SAMPLE & AGREED CHECKS↓APPROVED FINISHED PART

Power module cooling plate machining starts with the released package drawing, mounting datums and final inspection state. Define the loss map and airflow for a heat sink, or the fluid, inlet conditions and flow for power module liquid cooling. Review SiC power module cooling against its specific package and operating inputs; semiconductor technology alone does not establish an interchangeable cooling interface.

  • Define the supplied parts, material and connection boundary.
  • Review your critical interfaces in their final production state.
  • Agree sample evidence before repeat-order release.
Compare thermal technology routes →

Package context: Infineon HybridPACK 2 mounting guide → · Microchip AN6408 baseplate-less mounting scope → · onsemi F5 baseplate mounting guide →. Use the current guide for your exact package; numeric vendor limits and supplier compatibility are not generalized here.

Compare Your Cold-Plate Material References

Compare bulk conduction and mass alongside your module contact stack, coolant, coatings and manufacturing route. These references are not finished power module cooling tests or material substitution approvals.

Typical thermal conductivity

6061-T6 · 25°C167 W/(m·K)
Cu-ETP annealed · 20°C394 W/(m·K)

Hydro 6061-T6 at 25°C. KME Cu-ETP annealed at 20°C.

Density reference

60612.7 g/cm³
Cu-ETP8.92 g/cm³

Calculate finished mass from the actual geometry. A material conductivity difference does not establish a device-temperature reduction.

Selected composition limits · weight %
GradeEuropean referenceSiFeCuMnMgZnAl
6061EN AW-6061 · AlMg1SiCu0.40–0.80≤0.700.15–0.40≤0.150.80–1.20≤0.25Balance
C11000Cu-ETP · CW004A——≥99.90————

Selected elements only. Dash means not specified in this summary, not zero. 6061: Cr 0.04–0.35%, Ti ≤0.15%; C11000: O ≤0.040%; do not relabel Cu-ETP as oxygen-free copper. Aluminum other elements ≤0.05% each / ≤0.15% total. The purchasing standard and certificate govern. Confirm product form, temper, joining compatibility and required final condition.

Sources: Hydro 6061 → · KME Cu-ETP →

3 Views of Your Module Contact and Approval Plan

Compare geometric heat flux, package interface and evidence scope. The arithmetic is chosen for explanation and does not predict module temperature or finished cooling performance.

1 · Chosen footprint comparison

20 × 20 mm · 4 cm²25 W/cm²
40 × 40 mm · 16 cm²6.25 W/cm²
60 × 40 mm · 24 cm²4.17 W/cm²

Chosen example: 100 W divided by 4, 16 or 24 cm² gives 25, 6.25 or approximately 4.17 W/cm². These are geometric averages, not package ratings, measured heat flux or temperature predictions. Actual source distribution, spreading, contact and convection still require review.

2 · Identify the real interface

EXACT PACKAGE + MOUNTING INSTRUCTIONS↓FLAT CONTACT STACK OR SPECIFIED FLUID BOUNDARY↓SUPPORT + SEALS + FINAL INSPECTION STATE

Do not interchange a baseplate, baseplate-less or direct-fluid package interface from a generic illustration. Match the selected module and installation documentation.

3 · Name the approval owners

PART GEOMETRY + MATERIAL + JOINING↓DEFINED LEAK / PRESSURE SCOPE↓THERMAL + HYDRAULIC + ELECTRICAL VALIDATION

Agree the configuration, losses, mounting, interface materials, sensors and operating cases. A dimensional or fluid-integrity record does not establish the module temperature or electrical qualification.

Review Your Surface and Cleanliness Requirements

Separate your thermal contact faces, sealing interfaces and wetted passages. Confirm the specified final condition with the mating assembly.

Illustrative solid module contact land on a power module cold plate concept, not documentary company or customer photography

Define the module contact area and final surface inspection state from the released drawing.

A finish is not a universal cooling improvement. Confirm its purpose, compatibility and inspection state. Review surface finishing options →

Illustrative engineering concepts

Define Your Functional Features

Put the dimensions that control sealing, assembly fit and heat transfer on your drawing.

Illustrative sectioned power module cold plate passage and solid contact land concept, not documentary company or customer photography

Illustrative power module cold plate section concept

Contact footprint

Module loss map, selected TIM and approved clamping stack

Ports and seals

Thread designation, seal land and fitting engagement

Mounting datums

Hole pattern, datum scheme and tool access

Cover and passages

Joining access, wall thickness and cleaning scope

Final condition

Flatness, masking, protected interfaces and inspection state

Resolve 6 Design Risks Before Your Order

Resolve contact flatness, TIM and isolation responsibility, connection checks, material, operating conditions and approval evidence.

Package-specific contact plane

Specify power module cooling plate flatness, roughness, inspection area and final manufacturing state from the selected package instructions and released drawing. A baseplate-less package and a baseplate package must not be assigned one assumed universal contact requirement.

Your input

Controlled drawing and the relevant service conditions.

Your acceptance

Agreed method, inspection state, limits and required records.

Illustrative package-specific contact plane review for power module cooling components concept, not documentary company or customer photography

Illustrative engineering concept

5 Checkpoints from Drawing to Repeat Supply

Drawing review

Confirm revision, interfaces and operating inputs.

Route review

Agree materials, joining and final machining.

Sample build

Review the finished component and assembly fit.

Agreed checks

Assess specified dimensions, joints and test records.

Production release

Release the accepted revision, packaging and repeat-order scope.

Approve Your Manufactured Interface Before Repeat Supply

Illustrative power module cooling dimensional inspection concept, not a customer part

Illustrative component concept

Your package drawing and mounting instructions should trace to the final contact plane, mounting holes, fluid ports and delivered material records. Agree sample dimensions, fit, joining evidence, cleanliness and specified leak checks. The module or system owner approves thermal and electrical behavior under the agreed conditions.

  • Material identity and drawing revision
  • Module contact face, mounting datums and ports
  • Specified joining and test evidence
  • Contact-face and port protection, packaging and release
Review quality requirements →

Match Your Cooling Part to the Released Power Module

These are component review contexts, not customer cases, automotive qualification, certified converters or endorsed package compatibility.

Illustrative generic power modules on a closed cold plate integration fixture concept, not documentary company or customer photography

Industrial drives

Review the selected module loss map and installed cooling route.

Power converters

Control contact footprint, mounting and nearby keep-outs.

Renewable power equipment

Define operating conditions and the approval owner.

Charging power stages

Review coolant connections or available airflow.

Traction component prototypes

Match the released module interfaces and supplied part scope.

Power supply modules

State exact footprints and the dissipated losses.

Validation fixtures

Control TIM, mounting, sensor positions and operating inputs.

Replacement cooling parts

Match the exact module and installed revisions.

Compare thermal manufacturing routes →

6 Inputs for Your Power Module Cooling Quote

  1. Exact module part number + current package instructions
  2. Dissipated losses, source footprint + duty cycle
  3. Contact stack or direct-fluid boundary + isolation owner
  4. Datums, holes, support points + keep-outs
  5. Installed airflow or coolant, inlet temperature + flow allowance
  6. Material, quantities + sample records and validation owner

Ask your quote to separate component manufacturing, joining, finishing, inspection and any independently agreed validation. The drawing review confirms availability, quantities and delivery scope.

Answers Before You Specify

What module data is needed to quote a power module cooling part?

Provide the exact part number, package and mounting documentation, controlled component and assembly drawings, loss map, temperature limits, duty cycle, contact stack or direct-fluid boundary, installed air or coolant conditions, quantities and required acceptance records.

Can one flatness specification cover every power module?

No. Use the current mounting instructions for the selected package and the controlled drawing. Contact area, baseplate construction, clamping arrangement, TIM and final inspection state differ. Do not copy a tolerance from an unrelated module or catalog illustration.

Does a power module thermal interface material provide electrical insulation?

Do not assume so. Confirm the dielectric function and installation requirements of the exact module and specified interface system. Thermal conductivity, electrical isolation and qualification are distinct properties and approval scopes.

Which tests are needed to approve a power module cold plate sample?

Agree material identity, final contact geometry, mounting and port dimensions, fit, cleanliness and any specified leak or pressure checks. Define thermal, hydraulic and electrical validation separately with losses, mounting, interface materials, operating inputs and sensor locations.

Are flat-base and direct-liquid-cooled packages interchangeable?

Not by default. Confirm the selected package's physical and fluid boundary, sealing geometry, support, mounting and approved coolant requirements. A change of package can require a different cooling part and a new validation plan.

Does a larger contact area guarantee a cooler module?

No. Contact area is one input alongside heat distribution, spreading, interface thickness, mounting and convection. The example chart compares chosen geometric heat flux only; it is not a temperature or thermal-resistance prediction.